Semiconductor Targets

Tosoh SMD offers a variety of high purity metals and alloys for the Semiconductor Industry.

We are capable to support products for wafer sizes <150 mm through 450 mm. A few of these products are highlighted here and Tosoh SMD is able to provide many more materials and custom alloys upon request.

Tosoh SMD provides splat free Aluminum target material through a combination of our advanced metallurgy, assembly technology, high yield backing plates and nondestructive testing methods.
Copper is used for a variety of thin film applications including as a conductor material in logic and memory devices.
Tantalum is used for a variety of thin film applications: as a diffusion barrier material in logic, and memory devices, as a gate electrode in MOSFET devices and as a protective coating on print head devices.
Titanium is used for a variety of thin film applications including as a diffusion barrier material in logic and memory devices, abrasion and wear resistant coatings, and optical coatings.
Tosoh SMD provides a variety of metals and alloys for Salicide, Contact, and Barrier coatings for specialty applications within the Semiconductor Industry applications ranging from BUMP to MEMS.

Tosoh SMD, Inc.
3600 Gantz Road
Grove City, OH 43123
Tel: +1 614 875 7912
E-mail: [email protected]

Tosoh